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SiC Webinar December 2022 - On Demand StdTpc-Documentation/Training 1 — Mechanical Specification for

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1 — Mechanical Specification for Boxes and Pods Used to Transport and Store 300 mm Wafers

1  This Standard partially specifies the FOUPs used to transport and store 300 mm wafers in an IC manufacturing facility

bear risks in execution and lead to high maintenance costs

as balloted

· A communication interface that transfers general-purpose data between equipment or between the host and equipment

SiC Webinar December 2022 - On Demand StdTpc-Documentation/Training 1 — Mechanical Specification for

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