G06400 - SEMI G64 - 全面めっきIC用リードフレーム（金，銀，銅，ニッケル，パラジウム/ニッケル，およびパラジウム）の仕様 Revision:SEMI G64-96 (Reapproved 0811) - Superseded The purpose of this Specification

The purpose of this Specification is to standardize requirements for n-butyl acetate used in the semiconductor industry and to document testing procedures to support those specifications

These Guides may be used to help determine the parameters that should be monitored for UPW that is produced

4-1022 (Reapproved 0224)

org で入手可能となる。初版は2005年3月発行，前版は2010年3月に発行された。

注意：本基準中的正式數值皆以國際單位制（SI）表示。下列數值並非正式數值，僅供參考：

G06400 - SEMI G64 - 全面めっきIC用リードフレーム（金，銀，銅，ニッケル，パラジウム/ニッケル，およびパラジウム）の仕様 Revision:SEMI G64-96 (Reapproved 0811) - Superseded The purpose of this SpecificationNOTICE: This translation is a REFERENCE COPY ONLY. If differences should exist between the English version and a translation in any other language, the English version is the official and authoritative version. SEMI SEMI Assembly & Packaging Global Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1996200411 : P. P. F. SI Referenced SEMI Standards SEMI G4 Specification for Integrated Circuit