G08600 - SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending Revision:SEMI G86-0217 - Superseded SEMI E169-0615 (technical revision)

SEMI E169-0615 (technical revision)

the user must be specific in the selection of the tube and welded fitting s to be evaluated

and micro-bump are developed to ensure high-yield of the middle-end process

It assumes the existence of terminology described in other SEMI Flat Panel Display Documents

The GEM Standard defines which SECS-II messages should be used

G08600 - SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending Revision:SEMI G86-0217 - Superseded SEMI E169-0615 (technical revision)This Test Method defines a procedure for the evaluation of die strength by the mean of 3 point bending method. This Test Method applies only for 3 point bending method, and other methods will be defined by the separate documents. This Test Method is used to measure die strength for dies from processed wafers. Wafer thinning technology becomes popular to meet the demand for thin packages, so the die strength data is critical for the die quality and